| سال | هفته | ID | Title | ApplNo | IPC | Applicant | Subgroup | زیر گروه | رشته | شرح | Description |
|---|
2026 | 05 | WO/2026/020514 | CHAMFER PROCESSING PROCESS FOR AMELIORATING ROUGHNESS OF CHAMFERED SURFACE OF SILICON WAFER | CN2024/110879 | B24B 9/16 | SHANGHAI SEMICONDUCTOR WAFER TECHNOLOGY CO., LTD | PERFORMING OPERATIONS; TRANSPORTING | انجام عملیات؛ حمل و نقل | شکل دهی | 2026 | 05 | WO/2026/021111 | GRINDING DEVICE FOR GRINDING SMALL-DIAMETER, TALL SAMPLES, AND USAGE METHOD THEREFOR | CN2025/103678 | B24B 5/04 | TAIZHOU UNIVERSITY | PERFORMING OPERATIONS; TRANSPORTING | انجام عملیات؛ حمل و نقل | شکل دهی | 2026 | 05 | WO/2026/021737 | A GUIDE ELEMENT FOR A HAND TOOL | EP2025/066241 | B24B 9/00 | TT-PLATE OY | PERFORMING OPERATIONS; TRANSPORTING | انجام عملیات؛ حمل و نقل | شکل دهی | 2026 | 05 | WO/2026/023269 | GRINDING SYSTEM, GRINDING METHOD, AND CAST PRODUCT MANUFACTURING METHOD | JP2025/021217 | B24B 49/12 | JFE STEEL CORPORATION | PERFORMING OPERATIONS; TRANSPORTING | انجام عملیات؛ حمل و نقل | شکل دهی |